Additive Fan-Out Packaging for Discrete Components

conference paper








Smits, E.C.P.

Wadhwa, A.

Saalmink, M.

Burghoorn, M.

Kerkhof, I.

Pranger, R.

Meeuwsen, F.

Chiappini, F.

Brand, J. Van Den
The additive fan-out technology presented herein integrates advanced packaging technology with printed electronics to enable packaging in a cost-effective manner. We explore the application of the additive fan-out process to realize clip based DFN56 packages.
Topics




FO-PLPPrinted electronicsDiscrete powerAdvanced packagingAdditive processing
TNO Identifier
1026423
Repository link
https://resolver.tno.nl/uuid:1d585f6a-656a-449f-80f3-9c6db8c40761
DOI
https://dx.doi.org/10.1109/ICSJ66986.2025.11302733
ISBN
979-833150398-7
Publisher
Institute of Electrical and Electronics Engineers Inc (IEEE)
Source title
14th IEEE CPMT Symposium Japan, ICSJ 2025: Advanced Electronics Packaging Technology for Digital Twin, 12-14 November 2025, Kyoto, Japan
Pages
191-194
Files
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