Validation of constitutive models for electrically conductive adhesives
conference paper
By means of standard characterisation experiments, the parameters in a viscoelastic model were determined for a commercially available isotropically conductive adhesive. Next, two non-standard tests were conducted to validate the predictions of this model under conditions closer to the practical application of the adhesive. The performance of the viscoelastic model was compared to that of an elastic model Finally, the model was used to study the thermo-mechanical performance of a photovoltaics laminate during temperature cycling. The numerical simulations predict that the original design of the PV laminate results in excessively high stresses in the adhesive interconnect which are expected to cause failure and therefore a change in design is required.
Topics
TNO Identifier
240310
ISBN
1424411068
9781424411061
9781424411061
Article nr.
4201212
Source title
EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, 16 April 2007 through 18 April 2007, London, Conference code: 70646
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