Novel Additive Manufacturing Platform for Freeform 3D Microelectronics and Packaging

conference paper



Walsh, D.

Sol, J.A.H.P.

Ostendorf, P.

Akkerman, H.B.
Additive manufacturing of electronics offers new possibilities and functionalities for structural electronics and chip package design. Here we present our novel 3D microelectronics printing platform and a test setup to characterise printed electrical circuitry.
Topics



Additive manufacturing3D chip packagingDigital lithographyStructural electronics
TNO Identifier
1023723
Repository link
https://resolver.tno.nl/uuid:3e9f09f6-6366-45fe-9abe-3ad39a79b863
ISBN
979-8-3503-7781-1
Publisher
IEEE
Source title
13th IEEE Components, Packaging, and Manufacturing Technology Symposium Japan, Kyoto, Japan
Files
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