A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging

Weltevreden, E.R.; Tesarski, S.J.; Wymyslowski, A.; Erinc, M.; Gielen, A.W.J.

A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging

article

2012

Weltevreden, E.R.

Tesarski, S.J.

Wymyslowski, A.

Erinc, M.

Gielen, A.W.J.

Topics

Application area Chip packages Critical interfaces Electronic packaging Lead-frame Multi-scale approaches Reliability problems Stress levels Thermomechanical properties Degradation Mechanical properties Delamination

TNO Identifier

954366

Repository link

https://resolver.tno.nl/uuid:abe5f749-a3ca-481c-9fa4-239744705775

ISSN

00262714

Source

Microelectronics Reliability, 52(7), pp. 1300-1305.

Publisher

Elsevier

Pages

1300-1305

Files

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A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging

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