Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language

article




Borst, E.C.M. de

Etman, L.F.P.

Gielen, A.W.J.

Hofkamp, A.T.

Rooda, J.E.
Topics














Design structure matrix (DSM)Multidisciplinary design optimization (MDO)Distributed computer systemsLarge scale systemsLight emitting diodes (LEDs)Semiconductor device manufactureSilicon compoundsSpecification languagesSystem-in-packageDecomposition analysisMultidisciplinary couplingPartitioningSemiconductor technologySequencingStructural design
TNO Identifier
954728
Repository link
https://resolver.tno.nl/uuid:f03984e0-3355-4085-a93f-ae775d996b82
ISSN
1615147X
Source
Structural and Multidisciplinary Optimization, 53(6), pp. 1395-1411.
Publisher
Springer
Collation
17 p.
Place of publication
Heidelberg, Germany
Pages
1395-1411
Files
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