Additive Fan-Out Panel-Level Processing of MOSFET Devices
conference paper
We present CSAP (Competitive and Sustainable Advanced Packaging), a packaging technology that combines aspects of advanced packaging and printed electronics. CSAP distinguishes itself by replacing conventional compression molding with laser drilled vias and semi-additive plating by cost effective, fully additive printing processes. The cost benefits that printed electronics can bring with respect to traditional FanOut Panel Level Packaging (FO-PLP) are quantified using a costs model. We found that CSAP can potentially bring a significant reduction in the packaging cost with respect to standard FO-PLP as well as a significant reduction in capital expenditure required to setup manufacturing capabilities. The cost reduction for the CSAP originates mainly from the via’s forming process through screen printing, a parallel process, replacing the serial laser drilling process. The feasibility of the technology is verified with a proof of concept DFN silicon MOSFET package device.
TNO Identifier
1001278
ISSN
2687-9727
ISBN
979-8-3503-9036-0
Publisher
IEEE
Source title
IEEE 10th Electronics System-Integration Technology Conference (ESTC)
Pages
1-6
Files
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