Permeation barrier coatings for flexible electronics and polymer/inorganic layer interphase development in an expanding thermal plasma
conference paper
The multilayer system of alternated inorganic and organic layers is considered to be the winning technology for flexible electronics where water barrier permeability values as low as 10-6 g/m2day are required. Though successful results in terms of moisture permeation barrier are obtained, the role of the organic interlayer is still under discussion and not fully developed. Since the interlayer can affect the growth of the inorganic layer (and vice versa), as well as the final mechanical performance of the multilayer system, plasma deposition may be a useful tool in contributing to the improvement of a multilayer system design. Literature studies have, in fact, already reported on the development of an interphase between the polymer and the plasma-deposited inorganic layer, as being responsible for better polymer/inorganic layer adhesion. Our studies, therefore, are concerned with the interphase development between two layers (polymer/barrier layer), investigated by means of in situ and real time diagnostics, i.e., spectroscopic ellipsometry. The chosen plasma deposition technique is the expanding thermal plasma, a remote configuration where the ion bombardment towards the substrate is negligible. In this contribution, we also report on the moisture permeation barrier properties of inorganic films achieved by means of the expanding thermal plasma.
Topics
TNO Identifier
238906
ISSN
07375921
Source title
48th SVC Annual Technical Conference, 23-28 April 2005, Denver, CO, USA
Collation
6 p.
Pages
163-168
Files
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