Device and method for treating the surface of an optical element of a lithography system in an atomic layer deposition process or an atomic layer etching process : Vorrichtung und verfahren zum bearbeiten einer Oberflache eines Optischen Elements einder Lithographieanlage in einem atomlagen-depositionsprozess oder einen atomanlagen-ätzprozess.
patent
The invention relates to a device (100) for treating the surface (102) of an optical element (101) of a lithography sysstem (I), in particular an EUV lithography system, in an atomic layer treatment process, comprising: a sample holder (11O) for holding the optical element (101) during the treatment process; a treatmemt head (120) with a first outlet (121) for supplying a first precursor fluid (PFI) to a treatment region (102A) on the surface (102) of the optical elemert (101), a cleaning assembly (123) for removing excess first precursor fluid (PFI) out of the treatment region (102A), and a second outlet (122) for supplying a second precursor fliud (PF2) into the treatment region (102A), wherein the first precursor fluid (PFI) and the second precursor fluid (PF2) are selected in order to carry out an atomic layer deposition process for an atomic layer etching process in the treatinent region (102A), and the first or the secoud precursor fluid (PFI. PF2) is a liquid; and a movement unit (130) which is designed to move the treatmemt head (120) and/or the sample holder (110) together with the optical element (101) relative to each other such that the first outlet (121), the cleaning assembly(123), and the second outlet (122) are guided one after the other over the treatment region (102A).
TNO Identifier
992844
Publisher
WIPO/PCT
Article nr.
WO 2023/247496 A1
Collation
63 p.
Files
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