Time-dependent behaviour of pen foil used as substrate for lithography-based flexible electronics
conference paper
Main objective of this research work is to accurately measure and predict in-plane micro-deformation and bending of foil-on-carrier during lamination and lithographic process. It was demonstrated that lamination of foil on carrier introduced (1) an average in-plane micro-expansion of ε = 1819±262 ppm independently of foil orientation and (2) bending up to 300 μm, which was strongly related to the foil thickness. Besides this initial in-plane expansion introduced by lamination, the thermal steps of lithography process introduce additional micro-deformation to the foil. To be able to predict the micro-deformation and also time-dependent behaviour of foil-on-carrier, a multimode Maxwell model was employed. The parameters of this model were identified by fitting to the storage and loss moduli measured by DMTA. It was shown that: (1) the used high resolution measurement technique was able to measure in-plane micro-deformation of foil fixed on carrier; (2) a classical model for linear viscoelasticity was used to predict time-dependent behaviour of foil-fixed on carrier. Obtained experimental data and modelling approach were used to optimize the lithography process.
TNO Identifier
241034
ISSN
0094243X
ISBN
9780735405707
Publisher
American Institute of Physics AIP
Source title
4th International Conference on Times of Polymers (TOP) and Composites, 21-24 September 2008, Ischia, Italy
Place of publication
3 p.
Pages
15-17
Files
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