Subsurface Ultrasonic Resonant Force Microscopy for Image-based Overlay Measurement
other
Scanning Probe Microscopy (SPM) has emerged as a metrology solution for the semiconductor industry enabling high throughput defect review and high resolution 3D metrology. TNO has developed a Subsurface Ultrasonic Resonant Force Microscopy (SSURFM) for non-destructive, high resolution imaging of features buried under one or more layers of material. Challenging targeted applications for this technique are overlay metrology and wafer alignment through optically opaque layers and overlay and alignment on product features, which requires device resolution. Using the TNO SSURFM technique, sub-surface measurements on two overlay and alignment targets have been performed. The goal of this study is to show the potential of the technique for Overlay/Alignment Applications.
Topics
TNO Identifier
867692
Publisher
TNO
Source title
SID Semicon Innovation Day, Science Centre Delft, 21 May 2019
Collation
1 p.
Place of publication
Delft
Files
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