Modelling and characterization of optical micromachined ultrasound sensors with a silicon photonic ring resonator in a buckled acoustical membrane
conference paper
Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicondioxide acoustical membrane. This work presents new OMUS modelling: acoustomechanical non-linear FEM and photonic circuit equations. We show that initial wafer
stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up- or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary for the design of robust and sensitive sensors.
stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up- or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary for the design of robust and sensitive sensors.
TNO Identifier
867259
Source title
IEEE Photonics Society Benelux Chapter Belgium 2018
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