Submicrometer Top-Gate Self-Aligned a-IGZO TFTs by Substrate Conformal Imprint Lithography
article
Thin-film transistors (TFTs) are the fundamental building blocks of today's display industry. To achieve higher drive currents and device density, it is essential to scale down the channel lengths of TFTs. To be able to fabricate short-channel TFTs in large volumes is also equally important in order to realize lower fabrication costs and higher throughput. In this paper, we demonstrate the application of substrate conformal imprint lithography (SCIL) to pattern top-gate (TG) self-aligned (SA) amorphous indium gallium zinc oxide TFTs down to channel length L G = 450 nm with good device scaling properties resulting in average field-effect mobility (? FE ) = ? 10 cm 2 ·V -1 ·s -1 , V ON = ? 0.5 V, and subthreshold swing (SS) = ? 0.3 V/decade. The device performance as a function of channel length outlines the importance of dopant diffusion control for realizing submicrometer SA TFTs. The results demonstrate the compatibility of SCIL-based large-area patterning for the realization of submicrometer TG SA TFTs with a potential for high throughput. © 2019 IEEE.
Topics
Amorphous indium gallium zinc oxide (a-IGZO)Amorphous filmsAmorphous semiconductorsField effect transistorsGallium compoundsII-VI semiconductorsLithographyNanoimprint lithographySemiconducting indium compoundsThin film circuitsThin filmsZinc oxideAmorphous indium gallium zinc oxides (a igzo)Imprint lithographyNano-imprintSelf-alignedThin film transistors
TNO Identifier
866265
ISSN
189383
Source
IEEE Transactions on Electron Devices, 66(4), pp. 1778-1782.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Article nr.
8653974
Collation
p.
Pages
1778-1782
Files
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