Integration with Light
conference paper
This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on microbumps formed with conventional Sn-Ag-Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials. © 2018 IEEE.
Topics
Conductive adhesiveLIFTNIR curingPhotonic solderingAdhesivesCopper alloysElectric lampsFlexible electronicsInfrared devicesLead-free soldersLight absorptionLight emitting diodesLow temperature operationsPlastic bottlesSilver alloysSolderingSubstratesSurface mount technologyTemperatureTin alloysConductive adhesiveFlip chip bondingLaser printingLow temperature bondingSAC-soldersFlip chip devices
TNO Identifier
861670
ISBN
9781538668139
Publisher
Institute of Electrical and Electronics Engineers Inc.
Article nr.
8546477
Source title
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings, 7th Electronic System-Integration Technology Conference, ESTC 2018, 18 September 2018 through 21 September 2018
Files
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