Back End Monolithic Serial Interconnection Technology for CIGS with Shunt-free Laser Scribing and Inkjet Printing
conference paper
Back end interconnection technology is presented for CIGS using laser scribing and inkjet printing of dielectric material. Shunt-free laser scribing of CIGS is shown, which is essential in the back end approach for monolithic serial interconnection. Full back end interconnected mini-modules of 20x20cm2 were made and show no electrical losses compared to the reference cells. These results show the feasibility of complete module manufacturing after full area deposition of the CIGS stack, enabling cheaper and more flexible production of PV modules. © 2018 IEEE.
Topics
TNO Identifier
861668
ISBN
9781538685297
Publisher
Institute of Electrical and Electronics Engineers Inc.
Article nr.
8548280
Source title
2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC, 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018, 10 June 2018 through 15 June 2018
Pages
3567-3570
Files
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