Copper-based volumetric filler dedicated for Ag paste for depositing the front electrodes by printing on solar Si cells
article
In this work we present research results on a new paste NPCuXX based on a copper composite for fabrication of front electrodes in silicon solar cells. The CuXX composite is obtained by chemical processing of copper powder particles and can be used in two ways: as an additive to commercially available paste or as a base material for a new paste, NPCuXX. The CuXX offers the possibility to exchange up to 30 and 50 wt.% Ag into Cu, which significantly decreases the solar cells material costs, and therefore, the overall solar cell price. Emphasis was placed on a proper mass suitable fabrication process of the CuXX component. The NPCuXX paste has been applied both to conventional cell structures such as aluminum-back surface field and passivated emitter and rear contact , and finally solar cells with front electrodes deposited by screen-printing method were fabricated and characterized by current-voltage techniques. This paper reports the first implementation of the copper volumetric material into a screen print paste used in a high-temperature metallization process to fabricate the front contacts of Si solar cells with a highest fill factor of 77.92 and 77.69% for the abovementioned structures, respectively. © 2018 by the authors.
TNO Identifier
844211
ISSN
19961944
Source
Materials, 11(12), pp. 1-13.
Article nr.
2493
Pages
1-13
Files
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