High Temperature Thin-Film Barriers for Foldable AMOLED Displays

conference paper
2018
Akkerman, H.B.

Pendayala, R.

Panditha, V.K.P.

Salem, A.

Shen, J.

Weijer, P. van de

Bouten, P.C.P.

Winter, S.H.P.M.

Diesen-Tempelaars, K. van

Haas, G.J.A.J.F. de

Steudel, S.

Huand, C.

Lai, M.

Huang, Y.

Yeh, M.

Kronemeijer, A.J.

Poodt, P.

Gelinck, G.
We present a thin-film dual-layer bottom barrier on PI that is compatible with 350°C backplane processing for OLED displays. We demonstrate OLEDs that survive bending over 0.5 mm radius for 10.000x. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating AMOLED displays on GEN1-sized substrates.
Topics
High-temperatureThin-film barrierFoldableAMOLED displays
TNO Identifier
843440
Repository link
https://resolver.tno.nl/uuid:99939e38-2503-4536-97db-8f4067d3ef9c
ISSN
0097966X
Publisher
Blackwell Publishing Ltd
Source title
Digest of Technical Papers - SID International Symposium
SID Symposium, Seminar, and Exhibition 2018, Display Week 2018. 20 May 2018 through 25 May 2018
Pages
717-720
Files
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