High-temperature thin-film barriers for foldable AMOLED displays

article

















Akkerman, H.B.

Pendyala, R.K.

Panditha, P.

Salem, A.

Shen, J.

Weijer, P. van de

Bouten, P.C.P.

Winter, S.H.P.M. de

Diesen-Tempelaars, K. van

Haas, G. de

Steudel, S.

Huang, C.Y.

Lai, M.H.

Huang, Y.Y.

Yeh, M.H.

Kronemeijer, A.J.

Poodt, P.

Gelinck, G.H.
We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high-temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active-matrix organic light-emitting diode displays on GEN1-sized substrates. © Copyright 2018 Society for Information Display
Topics



AMOLED displaysFoldableHigh temperatureThin-film barrier
TNO Identifier
820479
Repository link
https://resolver.tno.nl/uuid:8111dfbf-f8dc-4674-a990-1f89c185fbdf
ISSN
10710922
Source
Journal of the Society for Information Display, 26(4), pp. 717-720.
Publisher
Wiley-Blackwell Publishing Ltd
Pages
717-720
Files
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