Hybrid integration on low-cost flex foils using photonic flash soldiering
conference paper
Soldering of packaged electronic components using industry standard Sn-Ag-Cu (SAC) lead-free solders on low-cost foils, which are often the substrate of choice for flexible electronics, is challenging. This is mainly originating from the fact that the reflow temperatures of these solder alloys are normally higher than the maximum processing temperature of the low-cost flex foils. To enable component integration on the low-cost foils a novel method for soldering has been introduced by Holst Centre as an alternative to oven reflow, termed 'photonic soldering'. In this method high intensity photonic flashes are used to deliver the thermal energy required for soldering. By taking advantage of the selectivity of light absorption, the required energy for soldering is delivered to the components and circuit tracks while excessive heating of the foils is avoided. This paper presents successful photonic flash soldering of packaged LED components on low-cost polyethylene terephthalate (PET) foils using conventional SAC solders as a demonstration of the capabilities of this novel soldering technology.
TNO Identifier
749128
ISBN
9781509014026
Publisher
Institute of Electrical and Electronics Engineers Inc.
Article nr.
7764515
Source title
6th Electronic System-Integration Technology Conference, ESTC 2016. 13 September 2016 through 16 September 2016
Files
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