Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices
article
This study made an attempt to predict the temperature-dependent moisture diffusion of an epoxy molding compound with 3 different diffusion models: Fickian, dual stage and Langmuir diffusion. The Langmuir model provided the best prediction of the moisture diffusion when simulating the input experiments. Beyond the temperature range of the input experiments, the Langmuir model was still able to provide a fair prediction. Hence, the Langmuir model also provides better predictions for the moisture distribution in general. This allows for building on existing prediction models, enabling simulations of reliability tests like UHST.
TNO Identifier
572311
ISSN
0026-2714
Source
Microelectronics Reliability, 62, pp. 45-49.
Publisher
Elsevier
Article nr.
MR-11962
Collation
5 p.
Pages
45-49
Files
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