Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 : Preface

conference paper
2015
Kondo, K.

Mathad, G.S.

Akolkar, R.

Dow, W.P.

Philipsen, H.

Hayase, M.

Koyanagi, M.

Kaneko, Y.

Roozeboom, F.
TNO Identifier
528467
Repository link
https://resolver.tno.nl/uuid:cb476472-bb2b-4d71-a98f-7f969cc9fb1f
Publisher
ECS
Source title
Processing Materials of 3D Interconnects, Damascene and Electronics pacakaging 7, held during the 228th meeting of The Electrochemical Society, in Phoenix, AZ, from October 11 to October 15, 2015.
Collation
VI p.
Files
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