Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology
conference paper
Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin2ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjetprinting technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging. cop. (2014) Trans Tech Publications, Switzerland.
'Conseil General de l'Aube'; Conseil National de la Recherche Scientifique (CNRS); et al; Grand Troyes; Proto Manufacturing; Region Champagne-Ardenne
'Conseil General de l'Aube'; Conseil National de la Recherche Scientifique (CNRS); et al; Grand Troyes; Proto Manufacturing; Region Champagne-Ardenne
TNO Identifier
516497
ISSN
10226680
ISBN
9783038351535
Publisher
Trans Tech Publications Ltd
Source title
9th European Conference on Residual Stresses, ECRS 2014, 7 July 2014 through 10 July 2014, Troyes
Pages
930-935
Files
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