Laser-assisted Wafer Processing : New Perspectives in Through-Substrate Via Drilling and Redistribution Layer Deposition

bookPart



Hoppenbrouwers, M.B.

Oosterhuis, G.

Knippels, G.

Roozeboom, F.
Topics


TSV drilling and fillingLaser assistedWafer level packaging and 3-D integration
TNO Identifier
502654
Repository link
https://resolver.tno.nl/uuid:db3df7ee-81da-405c-ad3b-8012577abbae
ISBN
978-3-527-33466-7
Publisher
Wiley-VCH Verlag GmbH & Co.
Source title
3D Process Technology
Editor(s)
Garrou, P.
Koyanagi, M.
Ramm, P.
Place of publication
Weinheim
Pages
121-133
Files
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