Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates
article
This paper describes and compares two integration methods to structurally laminate and interconnect foil-based components with flexible polymeric substrates. The first method uses isotropic conductive adhesives (ICA) confined in laser-ablated through foil vias (TFV), while the second one uses an anisotropic conductive adhesive (ACA). Both procedures were successfully demonstrated by interconnecting silver-based inkjet printed and gold-sputtered interdigitated capacitive humidity sensors onto flexible PEN carrier substrates, showing functionality, high process yield and low-complexity. The robustness of the assemblies was tested and compared for adhesion, bending, high humidity and temperature cycling. Confined ICA vias show higher mechanical robustness to bending, while both methods remained functional after more than 900 h of environmental ageing. Finally, the interconnections were fully validated at different levels of relative humidity (RH) by comparing the sensor response to that of a commercial sensor. © 2013 Elsevier B.V. All rights reserved.
Topics
(ACA/ICA)Anisotropic/isotropic conductive adhesivesCyclic bending testsEnvironmental ageingFoil-based humidity sensingFoil-to-foil interconnectionLow-temperature lamination(ACA/ICA)Conductive adhesiveCyclic bending testsEnvironmental ageingFoil-to-foil interconnectionHumidity sensingLow temperaturesHumidity sensorsLaminatingAdhesive joints
TNO Identifier
473196
ISSN
01679317
Source
Microelectronic Engineering, 110, pp. 52-58.
Pages
52-58
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