The kinetics of low-temperature spatial atomic layer deposition of aluminum oxide
article
Spatial atomic layer deposition can be used as a high-throughput manufacturing technique in functional thin film deposition for applications such as flexible electronics. This, however, requires low-temperature deposition processes. We have investigated the kinetics of low-temperature (< 100 C) spatial atomic layer deposition of alumina from tri-methyl aluminum and water. The water partial pressure and the exposure time were identified as the critical parameters in this process. © 2012 Elsevier B.V.
TNO Identifier
471063
ISSN
00406090
Source
Thin Solid Films, 532, pp. 22-25.
Collation
4 p.
Pages
22-25
Files
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