Thermal resistance investigations on new leadframe-based LED packages and boards
article
In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys® software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster® transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board showing good correlation between experimental and simulation results. Low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based package and have been compared with standard Rebel LEDs on board.
TNO Identifier
460790
ISSN
00262714
Source
Microelectronics Reliability, 53(8), pp. 1084-1094.
Publisher
Elsevier
Article nr.
6191750
Collation
11 p.
Place of publication
Amsterdam
Pages
1084-1094
Files
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