Impact of materials on back-contact module reliability
conference paper
This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECNs back-contact modules performance and reliability. Damp-heat (85??C; 85% R.H) and thermal cycling (-40??C; +85??C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.
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TNO Identifier
821766
Publisher
ECN
Source title
35th IEEE Photovoltaic Specialist Conference, Honolulu, USA, 20-25 juni 2010.
Collation
4 p.
Place of publication
Petten
Pages
4 p.
Files