Novel methodology to integrate ultra-thin chips on flexible foils
conference paper
The placement and integration of ultra-thin chips (UTCs) on low-cost polymer foils is a key challenge in the realization of large-area flexible electronic products. Such products, are for cost reasons, preferably fabricated on low cost polyester foils like PET/PEN. A disadvantage of these materials is that they have a low thermal stability. As a consequence of this, the majority of existing chip integration technologies cannot be used. A novel approach for placement and interconnection of UTCs is presented in this paper. This approach, which involves face-up bonding of UTC and its subsequent interconnection, is compatible with low-cost polymer foils. The key process steps involved in UTC integration using the proposed methodology are discussed in detail. The fabrication of a technology demonstrator to validate the proposed concept is also detailed.
TNO Identifier
507175
ISBN
9781467346450
Publisher
IEEE Computer Society
Article nr.
6542068
Source title
4th Electronic System-Integration Technology Conference, ESTC 2012, 17-20 September 2012, Amsterdam, Netherlands
Files
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