A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
conference paper
Expanding the current smart packaging solutions to individual products requires improvement for several of the following properties: cost, thickness, weight, flexibility, conformability, transparency, and even stretchability. This paper focusses on an embedding technology that targets the first four properties, with an emphasis on cost reduction. The progress on the development work for this foil-based embedding is reported, along with a detailed failure analysis of the process flow. A functional demonstrator is realized in the form of a smart sensing label, including an embedded micro controller. Practical and technological shortcomings of the current technology are used as a starting point for proposing an improved embedding technology based on low-cost plastic materials. The first developments for lamination and via interconnection are described.
TNO Identifier
507168
ISBN
9781467346450
Publisher
IEEE Computer Society
Article nr.
6542155
Source title
2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 17 September 2012 through 20 September 2012, Amsterdam
Files
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