Overview on thermal and mechanical challenges of high power RF electronic packaging
conference paper
High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital-analog mixed circuit design, high power IC manufacturing technologies, and high power packaging design/process, in order to guarantee their performance and lifetime. In this paper, we overviewed our works on the packaging/assembly development of high power packages, including three parts: (1) Thermal simulation and die bond defect control (2) Mechanical integrity model for soft package heatsink implementation (3) Al wire multiphysics modeling and reliability of plastic power package.
Topics
TNO Identifier
478225
ISBN
9781618398505
Source title
44th International Symposium on Microelectronics 2011, IMAPS 2011, 9-13 October 2011, Long Beach, CA, USA
Pages
418-429
Files
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