Design for reliability of solid state lighting systems
article
This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a thermo-mechanical analysis is performed from a detailed LED board model to study reliability and lifetime limits, using thermal boundary conditions deduced from the thermal simulation of the whole LED lamp. Based on this analysis the weakest spots are identified as the metal vias in the LED package and the interconnection area between the LED package and copper tracks on the FR4 board. © 2012 Elsevier Ltd. All rights reserved.
TNO Identifier
464557
ISSN
00262714
Source
Microelectronics Reliability, 52(9-10), pp. 2294-2300.
Collation
7 p.
Pages
2294-2300
Files
To receive the publication files, please send an e-mail request to TNO Repository.