Novel interconnect methodologies for ultra-thin chips on foils
conference paper
Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requirements and demands on interconnects. In this paper, three novel interconnection methodologies for SiF are compared for a novel face-up integration approach for ultra-thin chip on foil. Laser scribing, inkjet printing and laser-induced forward transfer (LIFT) are the technologies compared with each other, as well as with electroplating, a standard technology widely used in the electronics industry. The comparison is based on experimental investigation into via filling, interconnect deposition, electrical conductivity and interconnect reliability. The selection of an interconnection technology for practical implementation is the key outcome of this paper. © 2012 IEEE.
TNO Identifier
464531
ISSN
05695503
ISBN
9781467319669
Article nr.
No.: 6248834
Source title
2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012, 29 May 2012 - 1 June 2012, San Diego, CA, USA
Collation
7 p.
Pages
238-244
Files
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