Laser induced forward transfer of interconnects for 3D integration
conference paper
Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSVs) for chip stacking, but also for other interconnect steps like re-distribution layers and solder bumps. Especially in applications with a low number (<100 mm-2) of relatively large features (10-100 μm diameter) with high aspect ratio (up to 1:10), conventional plating processes are slow and become cumbersome with increasing aspect ratio, thus becoming cost ineffective. Hence, industrially feasible, alternative direct-write processes are of interest for advanced interconnects. Laser Induced Forward Transfer (LIFT) is a direct write process with high potential to become a cost effective alternative for conventional patterned metallization schemes. Different process alternatives will be discussed and compared.
TNO Identifier
462707
ISSN
19385862
ISBN
9781566778244
Source title
Processing Materials of 3D Interconnects, Damascene and Electronics Packaging, 220th ECS Meeting, 9-14 October, 2011, Boston, MA, USA
Collation
10 p.
Pages
81-89
Files
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