Polymer-based 2D/3D wafer level heterogeneous integration for SSL module
conference paper
This paper demonstrates a heterogeneous integration of solid state lighting (SSL) module, including light source (LED) and driver/control components. Such integration has been realized by the polymer-based reconfigured wafer level package technologies and such structure has been prototyped and tested. The structure design, thermal design consideration, material selection & process technologies, and mechanical challenges will be also described in this paper. © 2012 IEEE.
TNO Identifier
460787
ISBN
9781467315128
Article nr.
6191808
Source title
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 16 April 2012 through 18 April 2012, Cascais
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