Modeling lead free solder reliability in SSL applications towards virtual design
conference paper
Life time predictions of microelectronics products are based on accelerated tests (ALT) [1]. The statistical distribution of failures, as typically shown in a Weibull plot, arise from the random variables such as material properties and geometric tolerances in manufacturing. These variations give rise to uncertainty in product life [2]. © 2012 IEEE.
TNO Identifier
460785
ISBN
9781467315128
Article nr.
6191755
Source title
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 16 April 2012 through 18 April 2012, Cascais
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