Characterization of intermetallic compounds in Cu-Al ball bonds: mechanical properties, delamination strength and thermal conductivity
conference paper
TNO Identifier
460371
Article nr.
No.: 5765798
Source title
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 16-18 April 2012, Lisbon, Portugal.
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