High power electronics package: from modeling to implementation
conference paper
Power electronics, such as high power RF components and high power LEDs, requires the combination of robust and reliable package structures, materials, and processes to guarantee their functional performance and lifetime. We started with the thermal and thermal-mechanical modeling of such component performances. With robust validation. Afterwards, an online testing method, design rules, and new structures/modifications have been implemented to improve the performance and reliability of high power electronics. This paper reviews our efforts on the RF transistors and high power LED's developments.
TNO Identifier
447064
ISSN
21505934
ISBN
9781457713880
Article nr.
6117183
Source title
6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011, 18-21 October 2011, Taipei, China
Collation
4 p.
Pages
249-252
Files
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