Design of Antenna-on-Chip, Antenna-on-Package and Detectors from RF, Microwave to THz Frequency Range in SiGe-C Technology
conference paper
Design solutions for on-chip signal detectors, Antenna-on-
Chip and Antenna-on-Package (with Bond Wire elements),
from RF, Microwave to THz frequency range, using state-of-theart
SiGe BiCMOS technology are presented. Both CML and
CMOS detectors are designed, fabricated and compared in terms
of their performances such as conversion gain and robustness
against process variations. Zero mask adder Schottky diodes
with low leakage current, low junction capacitance, large
breakdown voltage and with cut-off frequencies in the THz range
are demonstrated for detection, mixing and down-conversion.
Chip and Antenna-on-Package (with Bond Wire elements),
from RF, Microwave to THz frequency range, using state-of-theart
SiGe BiCMOS technology are presented. Both CML and
CMOS detectors are designed, fabricated and compared in terms
of their performances such as conversion gain and robustness
against process variations. Zero mask adder Schottky diodes
with low leakage current, low junction capacitance, large
breakdown voltage and with cut-off frequencies in the THz range
are demonstrated for detection, mixing and down-conversion.
TNO Identifier
441918
Source title
14th European Microwave Week 2011, EuMW2011: Wave to the future - Proceedings of the 6th European Microwave Integrated Circuits Conference, EuMIC 2011, 9-14 October 2011, Manchester, UK
Pages
228-231
Files
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