Modelling aluminium wire bond reliability in high power OMP devices
conference paper
In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is preferred and wedge-wedge wire bonding is widely used. As a result of poor wire shape design, wedge break can be found. Additionally, for the in-shin wires, which are typically very high and can reach high temperatures, failure by wire melting can be reached. © 2011 IEEE.
TNO Identifier
430110
ISBN
9781457701078
Article nr.
No.: 5765790
Source title
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Conference code: 85000
Pages
1-4
Files
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