FE modeling of Cu wire bond process and reliability
conference paper
Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the interface of wire and bond pad. This paper will present the finite element analysis of the copper wire bond process and IMC forming and results in the stress pattern shift during the processes. © 2011 IEEE.
TNO Identifier
430106
ISBN
9781457701078
Article nr.
05765789
Source title
12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz. Conference code: 85000
Pages
1/5-5/5
Files
To receive the publication files, please send an e-mail request to TNO Repository.