A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging
conference paper
Delamination of mating interfaces can cause serious reliability problems in different application areas. The causes of delamination are multiple. In the case of leadframe-based chip packages, a critical interface is that between the leadframe and the moulding compound. Delamination can magnify stress levels at the interface and can lead to fatigue of interconnects. © 2011 IEEE.
TNO Identifier
430101
ISBN
9781457701078
Article nr.
No.: 5765792
Source title
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Conference code: 85000
Collation
8 p.
Files
To receive the publication files, please send an e-mail request to TNO Repository.