MEMS silicon-based micro-evaporator with diamond-shaped fins
conference paper
A new design of micro-evaporators, with 45 channels (100 μm deep) and diamond-shaped fins (40μm wide, 160μm long, 20μm separation), is fabricated by anodic bonding of silicon and glass wafers, in a five masks process. This new design improves stability of the working conditions, and has a localized hot zone in the main part of the device. The measured absorbed heat includes the energy that heats up the coolant (water) from 25 to 100 ° C (roughly 300 J/g) and the latent heat of evaporation (2400 J/g). The latter one is a dominant term, and heat absorption is significantly increased at fin temperatures above the water boiling point.
Topics
Anodic bondingHeat transferTwo-phase flowAnodic bondingFin temperatureGlass waferHeat absorptionHot zoneNew designSilicon-basedWorking conditionsEvaporatorsFins (heat exchange)Forced convectionHeat transferHot workingSemiconducting silicon compoundsSilicon wafersTwo phase flowWater absorptionGlass bonding
TNO Identifier
427575
ISSN
18777058
Source title
24th Eurosensors Conference, 5 September 2010 through 8 September 2010, Linz. Conference code: 83056
Pages
969-972
Files
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