Direct Laser Write (DLW) as a versatile tool in manufacturing templates for imprint lithography on flexible substrates
conference paper
A computer-controlled laser beam recorder with a wavelength of 405 nm has been employed for patterning the deposited resist with feature sizes varying from a few hundreds of nanometers to tens of micrometers. Four inch silicon templates for hot embossing source/ drain electrodes and metallic circuit for a disposable biosensor were obtained. SEM and optical microscopy reveal accurate transfer of developed photoresist structures into the underlying silicon wafer after plasma dry etching. Etch depths between 100 - 600 nm were obtained on the templates, and were further transferred into the imprinted plastic substrate and the metallic layer. © 2009 SPIE.
Topics
Direct laser writeFlexible substrateHot embossingNanoimprint lithographyPlastic electronicsSilicon templateDirect laser writeDisposable biosensorDrain electrodesEtch depthFeature sizesFlexible substrateHot embossingImprint lithographyMetallic circuitsMetallic layersPlasma dry etchingPlastic electronicsPlastic substratesSEMVersatile toolsBiosensorsComputer control systemsLasersNanoimprint lithographyOptical microscopyPlasma etchingPlasticsSemiconducting silicon compoundsSilicon wafersSubstrates
TNO Identifier
279986
ISSN
0277786X
ISBN
9780819475244
Article nr.
No.: 72711S
Source title
Alternative Lithographic Technologies, 24-26 February 2009, San Jose, CA, USA