Integration in design and manufacturing of polymer smart devices
conference paper
Integration of functions in single components is pursued in order to manufacture smaller and smarter polymer micro devices at less cost, through e.g. less assembly steps. It requires integration on both product and production side. This paper addresses the use of molded interconnect device (MID) technology for the integration of electronic circuitry into polymer products. Shown will be new approaches of selective metallization for creating conductive tracks. The supply chain of MID parts is still seen as vulnerable, resulting in concerns on reliability of production and product. A solution is integration of processes in one production cell. Shown is the feasibility of integrating a surface patterning process into an injection molding tool.
TNO Identifier
248213
ISBN
9781615673278
Source title
67th Annual Technical Conference of the Society of Plastics Engineers, ANTEC 2009, 22-24 June 2009, Chicago, IL, USA
Pages
3011-3015
Files
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