Flipchip bonding of Si chip on flexible PEN foil using novel electronic 100 m pitch fan-out circuitry
conference paper
A novel, cost effective technology to manufacture high density embedded electronic circuitry is demonstrated. The process consists of laser photoablation of the circuitry into a substrate through a mask and subsequent filling using a polymer thick film paste. Because the volume of the substrate is used it is possible to make thick and thereby highly conductive lines using low cost materials and processes. The process is demonstrated for a fan out circuitry in 100 µm thick polyethylene naphthalate (PEN). The fan out circuitry has linewidths of 50 µm and line spacings of 100 µm. The usability of the circuitry is demonstrated by the successful flipchip bonding of a thinned Si daisy chain dummy chip with 176 IO's.
TNO Identifier
953985
ISSN
02729172
ISBN
9781605608
Publisher
MRS
Article nr.
1030-G05-10
Source title
Materials Research Society Symposium Proceedings
Collation
7 p.
Pages
54-60
Files
To receive the publication files, please send an e-mail request to TNO Repository.