Anodic bonding using the low expansion glass ceramic Zerodur®

article


Elp, J. van

Giesen, P.T.M.

Velde, J.J. van der
Using anodic bonding, a strong bond has been created between the ultralow expansion glass ceramic Zerodur® from Schott and an Al coated piece of ultralow expansion glass (ULE® from Corning). The bond strength has been tested using a tensile testing machine. The bond strength is comparable to the fracture strength of the ULE® material. Using anodic bonding it will be possible to make complicated electrostatic clamps for the next generation lithography machines based on an all ultralow expansion design.
Topics











AluminumCeramic materialsCoated materialsElectrostaticsFracture toughnessGlassLithographyTensile testingAnodic bondingUltralow expansion glassAnodic oxidationChemistry
TNO Identifier
238854
Repository link
https://resolver.tno.nl/uuid:362e0efc-5a8c-4b61-826b-d5c3c4f1cfe6
ISSN
10711023
Source
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 23(1), pp. 96-98.
Publisher
American Institute of Physics AIP
Collation
3 p.
Pages
96-98
Files
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