Multi Function and High Power Amplifier Chipset for X-Band Phased Array Frontends
other
This paper presents the design and measurement results of two MMICs for X-band phased array applications: a Multi Function Chip (MFC) and High Power Amplifier (HPA). The fully integrated MFC combines the phase and attenuation setting, Transmit/Receive (T/R) switching, Low Noise Amplifier and Driver Amplifier. Furthermore active biasing and a Low-Voltage CMOS compatible digital interface are included. The HPA design is matched to the MFC to create a two-chip T/R module solution and shows an excellent performance of 39.7 dBm output power with 46 % PAE at 9.0 GHz. © 2006 EuMA.
TNO Identifier
221532
Publisher
EuMA
Source title
Proceedings of the 1st European Microwave Integrated Circuits Conference, EuMIC 2006, 10-13 September 2006, Manchester, UK
Place of publication
Louvain-la-Neuve
Pages
237-240