The use of Electronic Speckle Pattern Interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads (Posterpresentatie)
conference paper
Recent developments in hardware and software have allowed traditional speckle pattern.
interferom.etry using photographic film to be replaced by digital video CCD cameras and
sophisticated analysing software. Real-time in-situ displacement measurement of specimens
under static or cyclic loads is now possible. In this paper the use of an electronic speckle
pattern interferometer (ESPI)for measuring the displacements in thin adhesive layers under
increasing load is discussed. Using specifically designed stiff double lap joints it was possible
to measure the displacements in adhesive layers of 0.2 mm thickness with submicron
resolution up to failure of the joint
interferom.etry using photographic film to be replaced by digital video CCD cameras and
sophisticated analysing software. Real-time in-situ displacement measurement of specimens
under static or cyclic loads is now possible. In this paper the use of an electronic speckle
pattern interferometer (ESPI)for measuring the displacements in thin adhesive layers under
increasing load is discussed. Using specifically designed stiff double lap joints it was possible
to measure the displacements in adhesive layers of 0.2 mm thickness with submicron
resolution up to failure of the joint
TNO Identifier
330078
Source title
SAE-VI, Bristol, 4-6 July, 2001
Pages
1-4
Files
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