The EUV program at ASML: an update
conference paper
With the realisation of the α-tool, ASML is progressing with the pre-commercialisation phase of its EUVL development. We report on the progress in the development of several key modules of the α-tool, including the source, wafer stage and reticle stage, wafer handling, baseframe, and optics modules. We demonstrate that the focus sensor meets its vacuum requirements, and that both stages after limited servo optimisation approach the required scanning performance. A particle detection system has been build for the qualification of the reticle handling module, and preliminary results show that 50nm particles can be detected. The optics lifetime program showed substantial progress by utilising caplayers to MoSi samples in order to suppress oxidation caused by H2O molecules under EUV illumination: a suppression ≥ 100× is achieved, compared to uncapped MoSi.
Topics
TNO Identifier
237291
ISSN
0277786X
Publisher
SPIE
Source title
Emerging Lithography Technologies VII, 25-27 February 2003, Santa Clara, CA, USA, Conference code: 61519
Editor(s)
Engelstad R.L.
Collation
12 p.
Pages
24-35