Searched for: subject%3A%22microscopy%22
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Quesson, B.A.J. (author), van Neer, P.L.M.J. (author), Tamer, M.S. (author), Hatakeyama, K. (author), van Es, M.H. (author), van Riel, M.C.J.M. (author), Piras, D. (author)
The semiconductor industry needs to fit ever more devices per unit area to improve their performance; hence a trend towards increasingly complex structures by varying material combinations and 3D geometries with increasing aspect ratios. The new materials used may be optically opaque, posing problems for traditional optical metrology methods....
conference paper 2022
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Shahmohammadi, M.S. (author), Parker, L.A. (author), Henke, S. (author), Urbanus, J.H. (author)
Microplastics are a growing environmental and toxicological concern, having been found in the remotest locations of the earth and within multiple organs of the human body. However, the scale of the problem is not yet fully known as the smallest micro- and nanoplastics (MNPs) cannot accurately be measured due to limitations in measurement and...
article 2022
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Nahar, S. (author), Porot, L. (author), Apostolidis, P. (author)
In the past years, the use of liquid additives as bitumen modifiers has increased to tailor the rheology of bitumen for a wide range of applications. Their chemical composition and mutual interaction result in specific phase morphologies in the binders. Hence, there is a need to evaluate the phase morphology of complex binders and the impact of...
article 2022
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Bugter, O. (author), Li, Y. (author), Wolters, A.H.G. (author), Agrawal, V. (author), Dravid, A. (author), Chang, A. (author), Hardillo, J. (author), Giepmans, B.N.G. (author), Baatenburg de Jong, R.J. (author), Amelink, A. (author), Backman, V. (author), Robinson, D.J. (author)
article 2021
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Ruijten, P. (author), Huinink, H.P. (author), Adan, O.C.G. (author)
article 2021
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Lebrun, M. (author), Nandillon, R. (author), Miard, F. (author), Bourgerie, S. (author), Visser, R. (author), Morabito, D. (author)
article 2021
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Small, J. (author), van Hoek, C. (author), van der Does, F. (author), Seinen, A.B. (author), Melzer, S. (author), Tromp, P.C. (author), van der Laan, S. (author)
A method has been developed to screen large numbers (~103–104 per sample) of coarse airborne dust particles for the occurrence of Pb-rich phases, together with quantification of the particles’ mineralogy, chemistry, and inferred provenance. Using SEM-EDS spectral imaging (SI) at 15 kV, and processing with the custom software PARC, screening of...
article 2021
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van Neer, P.L.M.J. (author), Quesson, B.A.J. (author), Tamer, M.S. (author), Hatakeyama, K. (author), van Es, M.H. (author), van Riel, M.C.J.M. (author), Piras, D. (author)
Several methods are being researched to detect and characterize buried nanoscale structures in hard solid samples. The most common acoustic method is acoustic microscopy. An acoustic microscope is based on a single element transducer operating in pulse-echo mode. The acoustic waves are coupled into a sample using a liquid couplant (eg water) and...
article 2021
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Piras, D. (author), van Neer, P.L.M.J. (author), Thijssen, R.M.T. (author), Sadeghian, H. (author)
article 2020
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van Es, M.H. (author), Quesson, B.A.J. (author), Mohtashami, A. (author), Piras, D. (author), Hatakeyama, K. (author), Fillinger, L. (author), van Neer, P.L.M.J. (author)
In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific...
conference paper 2020
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Keyvani Janbahan, A. (author), van der Veen, G. (author), Tamer, M.S. (author), Sadeghian Marnani, H. (author), Goosen, H. (author), van Keulen, F. (author)
The real-time and accurate measurement of tip-sample interaction forces in Tapping Mode Atomic Force Microscopy (TM-AFM) is a remaining challenge. This obstruction fundamentally stems from the causality of the physical systems. Since the input of the dynamic systems propagates to the output with some delay, and multiple different inputs can...
article 2020
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Zebregs, M. (author), Mayer, A.E.H.J. (author), van der Heijden, A.E.D.M. (author)
In this comparative study, a solid composite, AN/HTPB-based propellant was prepared by conventional processing in a mechanical mixer and by applying an advanced processing technique relying on resonant acoustic mixing (RAM). After curing of the propellants, cross-sections were prepared and characterized by scanning electron microscopy. Also the...
article 2020
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Quesson, B.A.J. (author), van Neer, P.L.M.J. (author), Es, M. (author), M.H. van, (author), Piras, D. (author), Hatakeyama, K. (author), Mohtashami, A. (author), van der Lans, M.J. (author)
In Subsurface Scanning Probe Microscopy (SSPM), Atomic Force Microscopy (AFM) is combined with ultrasound. The AFM cantilever is used as a receiver. At low frequencies (O(MHz)) the method can be used to measure the stiffness contrast in a sample and at high frequencies (O(GHz)) to measure scattering based contrast. Both variants use modulated...
conference paper 2020
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van Es, M.H. (author), Quesson, B.A.J. (author), Mohtashami, A. (author), Piras, D. (author), Hatakeyama, K. (author), Fillinger, L. (author), van Neer, P.L.M.J. (author)
In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific...
conference paper 2020
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Herfst, R.W. (author), Nulkes-de Groot, N. (author), Lucas, P. (author), Bijnagte, T. (author), Dekker, B. (author), Biemond, J.J.B. (author), van Riel, M.J.C.M. (author), van Essen, B.H.M.F. (author), van Koppen, M.E.C.T. (author), Oosterling, J.A.J. (author), Kramer, L. (author), Nieuwkoop, E. (author), Corbet, F. (author), Visser, L. (author), Man, H. (author)
We developed a new 3D-AFM technique that enables imaging of high aspect ratio trenches. By measuring both lateral and vertical forces on a cantilever tip, a subharmonic mode based on the attractive tip-sample forces becomes feasible. This enables the measurement of true 3D information of samples without causing damage. This is especially...
other 2019
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van Neer, P.M.L.J. (author), Quesson, B.A.J. (author), van Es, M.H. (author), van Riel, M.C.J.M. (author), Hatakeyama, K. (author), Mohtashami, A. (author), Piras, D. (author), Duivenvoorde, T. (author), van der Lans, M.J. (author), Sadeghian Marnani, H. (author)
The characterization of buried nanoscale structures nondestructively is an important challenge in a number of applications, such as defect detection and metrology in the semiconductor industry. A promising technique is Subsurface Scanning Probe Microscopy (SSPM), which combines ultrasound with Atomic Force Microscopy (AFM). Initially, SSPM was...
article 2019
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Witvoet, G. (author), Peters, J. (author), Kuiper, S. (author), Keyvani, S. (author), Willekers, R.W. (author)
TNO is developing a novel Large Dynamic Range Atomic Force Microscope (LDR-AFM), primarily but not exclusively designed for sub-nm accurate overlay metrology. The LDR-AFM combines an AFM with a 6 degrees- of-freedom interferometric positioning stage, thereby enabling measurements of sub-nm features on a wafer over multiple millimeters marker-to...
conference paper 2019
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Zhang, X. (author), Hoogeland, M.G. (author)
After chain making, proof load testing is used to evaluate if the chains are mechanically qualified. However, proof load testing may bring elongation in the chain links that may affect the corrosion performance of mooring chains in seawater. The influence of deformation and microorganisms on the corrosion properties of chain steel in seawater...
article 2019
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Roch, T. (author), Šimurka, L. (author), Ow-Yang, C.W. (author), Sezen, M. (author), Satrapinskyy, L. (author), Turutoğlu, T. (author)
Magnetron sputtering is widely used for deposition of silicon oxynitride (SiOxNy) coatings on glass in large-area applications. Since repeated deposition simulates the factory-scale in-line processing, amorphous aluminum-doped SiOxNy layers with thickness of about 250 nm were deposited by reactive pulsed DC sputtering in a multi-pass process...
article 2019
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van Neer, P.L.M.J. (author), van Es, M.H. (author), Piras, D. (author), Navarro, V. (author), Mohtashami, A. (author), van der Lans, M.J. (author), Sadeghian Marnani, H. (author)
This work details the initial simulation and experimental GHz SPM work carried out at TNO.
other 2019
Searched for: subject%3A%22microscopy%22
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