Searched for: subject%3A%22Thermomechanical%255C%2Bmodelling%22
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Xu, Q. (author), Hofmeyer, H. (author), Maljaars, J. (author), van Herpen, R.A.P. (author)
This paper presents two full-scale fire resistance tests of sandwich panels with connections, to verify one way coupled fire-structure simulations. The heat transfer simulations agree well with the tests, however, the structural response simulations show some differences compared to the start of the first test, which is a sandwich panel fa├žade....
conference paper 2022
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Doornink, J. (author), Coesel, M. (author), Lemmen, M.H.J. (author), van 't Hof, A. (author)
The EarthCARE satellite mission objective is the observation of clouds and aerosols from low Earth orbit. The payload will include active remote sensing instruments being the W- band Cloud Profiling Radar (CPR) and the ATLID LIDAR. These are supported by the passive instruments BroadBand Radiometer (BBR) and the Multispectral Imager (MSI)...
conference paper 2011
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Barink, M. (author), Goorhuis, M. (author), Giesen, P. (author), Furthner, F. (author), Yakimets, I. (author), TNO Industrie en Techniek (author)
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often...
conference paper 2009